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1
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35148848731
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Issue and Challenges of Double Patterning Lithography in DRAM
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S. -M. Kim, S. -Y. Koo, J. -S. Choi, Y. -S. Hwang, J. -W. Park, E. -K. Kang, C. -M. Lim, S. -C. Moon, J. -W. Kim, "Issue and Challenges of Double Patterning Lithography in DRAM", Proc. of SPIE, 6520, 65200H-1 (2007)
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Proc. of SPIE
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Kim, S.-M.1
Koo, S.-Y.2
Choi, J.-S.3
Hwang, Y.-S.4
Park, J.-W.5
Kang, E.-K.6
Lim, C.-M.7
Moon, S.-C.8
Kim, J.-W.9
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2
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35148837660
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Manufacturability Issues with Double Patterning for 50nm Half Pitch Single Damascene Applications, Using RELACS Shrink and Corresponding OPC
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M. O. Beeck, J. Versluijs, V. Wiaux, T. Vandeweycr, I. Ciofi, H. Struyf, D. Hendrckx, J. V. Olmen, "Manufacturability Issues with Double Patterning for 50nm Half Pitch Single Damascene Applications, Using RELACS Shrink and Corresponding OPC" , Proc. of SPIE, 6520, 652001-1 (2007)
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Proc. of SPIE
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Beeck, M.O.1
Versluijs, J.2
Wiaux, V.3
Vandeweycr, T.4
Ciofi, I.5
Struyf, H.6
Hendrckx, D.7
Olmen, J.V.8
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3
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35148844696
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Patterning with Amorphous Carbon Spacer for Expanding the Resolution Limit of Current Lithography Tool
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W. -Y. Jung, S. -M. Kim, C, -D. Kim, G. -H. Sim, S. -M. Jeon, S. -W. Park, B. -S. Lee, S. -K. Park, J. -S. Kim, L. -S. Heon, "Patterning with Amorphous Carbon Spacer for Expanding the Resolution Limit of Current Lithography Tool" , Proc. of SPIE, 6520, 65201C-1 (2007)
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Proc. of SPIE
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Jung, W.-Y.1
Kim, S.-M.2
Kim, C.-D.3
Sim, G.-H.4
Jeon, S.-M.5
Park, S.-W.6
Lee, B.-S.7
Park, S.-K.8
Kim, J.-S.9
Heon, L.-S.10
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4
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35148897294
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Ultra-low kl Oxide Contact Hole Formation and Metal Filling Using Resist Contact Hole Pattern by Double L&S Formation Method
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H. Nakamura, M. Omura, S. Yatnashita, Y. Taniguchi, J. Abe, S. Tanaka, S. Inoue, "Ultra-low kl Oxide Contact Hole Formation and Metal Filling Using Resist Contact Hole Pattern by Double L&S Formation Method" , Proc. of SPIE, 6520, 65201E-1 (2007)
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Proc. of SPIE
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Nakamura, H.1
Omura, M.2
Yatnashita, S.3
Taniguchi, Y.4
Abe, J.5
Tanaka, S.6
Inoue, S.7
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5
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35148884758
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Double Patterning with Multilayer Hard Mask Shrinkage for sub-0.25kl Lithography
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H. J. Liu, W. H. Hsieh, C. H. Yeh, J. S. Wu, H. W. Chan, W. B. Wu, F. Y. Chen, T. Y. Huang, C. L. Shin, J. P. Lin, "Double Patterning with Multilayer Hard Mask Shrinkage for sub-0.25kl Lithography" , Proc. of SPIE, 6520, 65202J-1 (2007)
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Proc. of SPIE
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Liu, H.J.1
Hsieh, W.H.2
Yeh, C.H.3
Wu, J.S.4
Chan, H.W.5
Wu, W.B.6
Chen, F.Y.7
Huang, T.Y.8
Shin, C.L.9
Lin, J.P.10
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6
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34648862054
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A Litho-Only Approach to Double Patterning
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A. Vanleenhove, D. V. Steenwinckel, "A Litho-Only Approach to Double Patterning", Proc. of SPIE, 6520, 65202F-1 (2007)
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Proc. of SPIE
, vol.6520
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Vanleenhove, A.1
Steenwinckel, D.V.2
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7
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51549115631
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Sub-40nm Half-Pitch Double Patterning with Resist Freezing Process
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M. Hori, T. Nagai, A. Nakamura, T. Abe, G. Wakamatsu, T. Kakizawa, Y. Anno, M. Sugiura, S. Kusumoto, Y. Yamaguchi, T. Shimokawa, "Sub-40nm Half-Pitch Double Patterning with Resist Freezing Process" , Proc. of SPIE, 6923-17(2008)
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Proc. of SPIE
, pp. 6923-7017
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Hori, M.1
Nagai, T.2
Nakamura, A.3
Abe, T.4
Wakamatsu, G.5
Kakizawa, T.6
Anno, Y.7
Sugiura, M.8
Kusumoto, S.9
Yamaguchi, Y.10
Shimokawa, T.11
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