Combined manufacture methods for high density LTCC substrates: Thick film screen printing, Ink Jet, postfiring thin film processes, and laser-drilled fine vias

Journal of Microelectronics and Electronic Packaging

Volumn 6, Issue 1, 2009, Pages 6-12

  Albertsen, Arne ^a   Koiwai, Koji ^a   Kobayashi, Kyoji ^a   Oguchi, Tomonori ^a   Aruga, Katsumi ^a  

^a Earth Wing Corporate Headquarters KOA Pine Park   (Japan)

Author keywords

Fine line printing; Fine via; Ink jet; LTCC; Thick film; Thin film

Indexed keywords

ELECTROLESS PLATING; FIGHTER AIRCRAFT; FLIP CHIP DEVICES; GOLD DEPOSITS; INK; MOUNTINGS; SCREEN PRINTING; SILVER; SUBSTRATES; THICK FILMS; THIN FILMS; ULTRAVIOLET LASERS;

FINE VIA; FLIP-CHIP MOUNTING; INK JET; LINE PRINTING; LTCC; PATTERNING PROCESS; SURFACE FINISHES; THICK FILM PRINTING;

INK JET PRINTING;

EID: 77951710122     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-6.1.6     Document Type: Article

References (7)

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