Thin-film fine-pattern technology for LTCC multilayer substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 59-64

  Anderson, Brian ^a   Horio, Shuichi ^a   Kobayashi, Kyoji ^b   Tamada, Nobuhiko ^b  

^a Koa Speer Electronics Inc   (United States)

^b Earth Wing Corporate Headquarters KOA Pine Park   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INSULATING MATERIALS; HIGH TEMPERATURE APPLICATIONS; LINEWIDTH; LITHOGRAPHY; THICK FILMS;

HIGH-FREQUENCY APPLICATIONS; LOW-HALOGEN INSULATION MATERIALS; MASS PRODUCTION;

THIN FILMS;

EID: 35348823649     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373777     Document Type: Conference Paper

References (7)

1. Hitachi chemical catalog data and internal measurement data.
2. Japan Jisso Technology Roadmap 2005. May 2005
3. th International Symposium on Microelectronics, IMAPS 2005, 823 (2005).
4. th International Symposium on Microelectronics, IMAPS 2006, 462 (2006).
5. T. Tanaka et al, "LTCC Multi-layer Substrate Utilized with Ink-jet Printed Silver Layers and UV Laser Drilled Micro Via," Proc. International Conference on Electronics Packaging, ICEP 2006, 392 (2006).
6. th JIEP Annual Meeting, March 2006, Tokyo, pp.167-168.
7. Ito, "Electricity and chemical deterioration phenomenon of the PWB," The Institute of Electrical Engineers of Japan, Electrical Insulating Materials, DEI-95-39 (1995).