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Volumn 29, Issue 5, 2010, Pages 849-

Erratum: Analytical expressions for high-frequency VLSI interconnect impedance extraction in the presence of a multilayer conductive substrate (IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2009) 28:7 (1047-1060))

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EID: 77951691279     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2010.2047753     Document Type: Erratum
Times cited : (2)

References (1)
  • 1
    • 67650895067 scopus 로고    scopus 로고
    • Analytical expressions for high-frequency VLSI interconnect impedance extraction in the presence of a multilayer conductive substrate
    • N. Srivastava, R. Suaya, and K. Banerjee, “Analytical expressions for high-frequency VLSI interconnect impedance extraction in the presence of a multilayer conductive substrate,” IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., vol. 28, no. 7, pp. 1047 1060, Jul. 2009.
    • (2009) IEEE Trans. Comput.-Aided Design Integr. Circuits Syst. , vol.28 , Issue.7 , pp. 1047-1060
    • Srivastava, N.1    Suaya, R.2    Banerjee, K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.