Application of nickel nanoparticles in diffusion bonding of stainless steel surfaces

Proceedings of the ASME International Manufacturing Science and Engineering Conference, MSEC2008

Volumn 2, Issue , 2009, Pages 441-446

  Tiwari, Santosh K ^a   Paul, Brian K ^a  

^a Oregon State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASTM STANDARDS; BOND LINE; BOND STRENGTH; BONDING PARAMETERS; BONDING PRESSURE; BONDING TEMPERATURES; CROSS SECTION; DIFFUSING SPECIES; DWELL TIME; HOT PRESS; IN-DIFFUSION; INTER-DIFFUSION; INTERMETALLIC PHASIS; LIQUID-PHASE DIFFUSION; MICROSTRUCTURE EVOLUTIONS; NICKEL NANOPARTICLES; SEM; STAINLESS STEEL 316L; STAINLESS STEEL SURFACE; TEM; X-RAY DIFFRACTION TECHNIQUES;

BOND STRENGTH (MATERIALS); BRAZING; DIFFUSION; MICROSTRUCTURE; NANOPARTICLES; NICKEL; NICKEL ALLOYS; OPTICAL MICROSCOPY; PHASE INTERFACES; PHOSPHORUS; SCANNING ELECTRON MICROSCOPY; STEEL CORROSION; TRANSMISSION ELECTRON MICROSCOPY; WAVELENGTH DISPERSIVE SPECTROSCOPY; X RAY DIFFRACTION;

STAINLESS STEEL;

EID: 77951614801     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/MSEC_ICMP2008-72151     Document Type: Conference Paper

References (18)

1. F.A. Calvo,A. Urena J,M.G.D. Salazar,F. Molleda,(1998)"Special features of the formation of the diffusion bonded joints between copper and aluminium" Journal of Materials Science,vol. 23,pp.2273-2280.
2. G.Q. Wu, Z.F. Li, G.X. Luo, H.Y. Li and Z. Huang, (2007), "Dynamic simulation of solid-state diffusion bonding," Materials Science and Engineering A, vol.452, pp. 529-535.
3. B. Derby, E.R. Wallach, (1984), "Diffusion Bonding: Development of Theoretical Model," Material Science, vol.18(9), pp. 427-431.
4. Z.X. Guo and N. Ridley, (1987), "Modeling of diffusion bonding of metals," Material Science and Technology, vol.3, pp. 945-953.
5. J. Pilling, D.W. Livesey, J.B. Hawkyard, N. Ridley, (1984), "Solid state bonding in superplastic Ti-6A1-4V," Metal Science, vol.18, pp. 117-122.
6. M. Ghosh, K Bhanumurthy, G.B. Kale, J. Krishnan and S. Chatterjee, (2003) "Diffusion bonding of titanium to 304 stainless steel," Journal Nuclear Materials, vol.322, pp. 152-158.
7. S. Kundu, S. Chatterjee, (2006), "Interfacial microstructure and mechanical properties of diffusion-bonded titanium-stainless steel joints using a nickel interlayer," Materials Science and Engineering, vol.A 425, pp. 107-113.
8. Peng He, Jiuhai Zhang, Ronglin Zhou, and Xiaoqiang Li, (1999), "Diffusion bonding technology of a titanium alloy to a stainless steel web with an Ni interlayer," Materials Characterization, vol.43, pp. 287-292. (Pubitemid 30526550)
9. N. Orhan, T.I. Khan and M. Eroglu, (2001), "Diffusion bonding of a microduplex stainless steel to Ti-6A1-4V," Scripta Materialia, vol.45, pp. 441-446.
10. J. Carmai, K.H. Baik, F.P.E. Dunne, P.S. Grant and B. Cantor, (2002), "Interface effects during consolidation in titanium alloy components locally reinforced with matrix-coated fiber composite," Acta Materialia, vol.50, pp. 4981-4993.
11. E.R. Naimon, J.H. Doyle, C.R. Rice, D. Vigil, D.R. Walmsley, (1981), "Diffusion welding of aluminum to stainless steel," Journal Welding, vol.60(11), pp. 17-20.
12. K. Bhanumurthy, D.J. Derose, G.B. Kale and J. Krishnan, (2004), "Solid state bonding of porous nickel electrode to AISI 304 austenitic stainless steel," Material Science and Technology, vol.20, pp. 1059-1063.
13. H. Burlet, M. Martenez and G. Cailletaud, (2001), "Microstructure and residual stresses issued from the bonding of an austenitic onto a ferritic steel by solid diffusion," Journal of Physics IV, vol.11 (4), pp. 4157-4164.
14. Sumitomo special metal company ltd., (2000), "Brazing filler alloy for stainless steel, brazed structure manufactured by using the brazing filler alloy, and brazing filler material for stainless steel," Europian Patent Application, PCT/JP99/05155.
15. J.A. McGurty and E.S. Funston, (1959), "Nickel-Chromium-Germanium alloys for stainless steel brazing," United States Patent, 2, 901, 347.
16. E.J. Ryan, (1988), Titanium-copper-nickel braze filler metal and method of brazing," United States Patent, 4, 725, 509.
17. K. Mohankumar and A.A.O. Tay, (2004), "Nano-particle reinforced solders for fine pitch applications," Electronics Packaging Technology Conference, Singapore, vol.6, pp. 455-461. (Pubitemid 41733808)
18. V. Philip, (2004), "High strength diffusion brazing utilizing nano-powders" United States Patents, US 2004/0050913 Al.