Solid state bonding of porous nickel electrode to AISI 304 austenitic stainless steel

Materials Science and Technology

Volumn 20, Issue 8, 2004, Pages 1059-1063

  Bhanumurthy, K ^a   Derose, D Joyson ^a   Kale, G B ^a   Krishnan, J ^a  

^a BHABHA ATOMIC RESEARCH CENTRE   (India)

Author keywords

Diffusion bonding; Effective diffusion coefficients; Porous nickel; Stainless steel

Indexed keywords

DIFFUSION-BONDED JOINTS; ELECTRON PROBE MICROANALYSIS (EPMA); SOLID STATE BONDING;

DIFFUSION; ELECTRODES; MICROSTRUCTURE; OPTICAL MICROSCOPY; OPTIMIZATION; POROUS MATERIALS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING; THERMAL EFFECTS;

NICKEL;

ALUMINUM; NICKEL; STAINLESS STEEL;

ARTICLE; CONCENTRATION (PARAMETERS); DIFFUSION; ELECTRON PROBE MICROANALYSIS; HARDNESS; POROSITY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLID STATE; STRUCTURE ANALYSIS; TECHNIQUE; TEMPERATURE DEPENDENCE;

EID: 4344689348     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708304225019920     Document Type: Article

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