Signal processing and fabrication of a biomimetic tactile sensor array with thermal, force and microvibration modalities

2009 IEEE International Conference on Robotics and Biomimetics, ROBIO 2009

Volumn , Issue , 2009, Pages 129-134

  Lin, Chia Hsien ^a   Erickson, Todd W ^b   Fishel, Jeremy A ^c   Wettels, Nicholas ^c   Loeb, Gerald E ^b  

^a SynTouch LLC   (United States)

^b University of Southern California   (United States)

^c UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT TEMPERATURES; CONTACT FORCES; EMBEDDED ELECTRONICS; ENTIRE SYSTEM; MATERIAL PROPERTY; MICROVIBRATIONS; SENSING MODALITIES; SENSOR MODALITY; SIGNAL CONDITIONING; TACTILE SENSOR ARRAY; THERMAL FLUXES; THERMAL TRANSIENTS;

PUMPS; RAILROAD ROLLING STOCK; ROBOTICS; SENSOR ARRAYS; SIGNAL PROCESSING;

BIOMIMETICS;

EID: 77951445426     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ROBIO.2009.5420611     Document Type: Conference Paper

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