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Volumn , Issue , 2009, Pages

Millimeter-wave and terahertz wireless RFIC and on-chip antenna design: Tools and layout techniques

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN RULES; MM-WAVE; ON CHIP ANTENNA; SIMULATION TOOL; TERA HERTZ; TRANSMISSION LINE; UNIVERSITY OF TEXAS; WIRELESS NETWORKING; WIRELESS SYSTEMS;

EID: 77951200031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/GLOCOMW.2009.5360682     Document Type: Conference Paper
Times cited : (7)

References (23)
  • 2
    • 77951156607 scopus 로고    scopus 로고
    • Do you need wireless video transmission for your hdtv? Maybe, sort of
    • June 18, online article
    • L. E. Frenzel, "Do you need wireless video transmission for your hdtv? maybe, sort of," Electronic Design, June 18 2009, online article: http://electronicdesign.com/Articles/ArticleID/21401/21401.html.
    • (2009) Electronic Design
    • Frenzel, L.E.1
  • 4
    • 47649123445 scopus 로고    scopus 로고
    • Novel on-chip antenna structures and Frequency Selective Surface (FSS) approaches for millimeter wave devices
    • -Oct. 3 2007
    • L. Ragan, A. Hassibi, T. S. Rappaport, and C. Christianson, "Novel On-Chip Antenna Structures and Frequency Selective Surface (FSS) Approaches for Millimeter Wave Devices," IEEE Vehicular Technology Conference 2007, pp. 2051-2055, 30 2007-Oct. 3 2007.
    • (2007) IEEE Vehicular Technology Conference 2007 , vol.30 , pp. 2051-2055
    • Ragan, L.1    Hassibi, A.2    Rappaport, T.S.3    Christianson, C.4
  • 13
    • 0038012473 scopus 로고    scopus 로고
    • Investigation of the impact of conductor surface roughness on interconnect frequency-dependent ohmic loss
    • L. Proekt and A. Cangellaris, "Investigation of the impact of conductor surface roughness on interconnect frequency-dependent ohmic loss," in Electronic Components and Technology Conference, 2003. Proceedings. 53rd, 27-30, 2003, pp. 1004-1010.
    • (2003) Electronic Components and Technology Conference, 2003. Proceedings. 53rd , vol.27-30 , pp. 1004-1010
    • Proekt, L.1    Cangellaris, A.2
  • 16
    • 0035415630 scopus 로고    scopus 로고
    • Novel approach for a design-oriented measurement-based fully scalable coplanar waveguide transmission line model
    • DOI 10.1049/ip-map:20010544
    • G. Carchon, W. De Raedt, and B. Nauwelaers, "Novel approach for a design-oriented measurement-based fully scalable coplanar waveguide transmission line model," Microwaves, Antennas and Propagation, IEE Proceedings -, vol. 148, no. 4, pp. 227-232, Aug 2001. (Pubitemid 32909173)
    • (2001) IEE Proceedings: Microwaves, Antennas and Propagation , vol.148 , Issue.4 , pp. 227-232
    • Carchon, G.1    De Raedt, W.2    Nauwelaers, B.3
  • 17
    • 0038236451 scopus 로고    scopus 로고
    • Attenuation mechanisms of aluminum millimeter-wave coplanar waveguides on silicon
    • March
    • C. Schollhorn, W. Zhao, M. Morschbach, and E. Kasper, "Attenuation mechanisms of aluminum millimeter-wave coplanar waveguides on silicon," Electron Devices, IEEE Transactions on, vol. 50, no. 3, pp. 740-746, March 2003.
    • (2003) Electron Devices, IEEE Transactions , vol.50 , Issue.3 , pp. 740-746
    • Schollhorn, C.1    Zhao, W.2    Morschbach, M.3    Kasper, E.4
  • 18
    • 33749511390 scopus 로고    scopus 로고
    • Experimental characterization of copper/low-k transmission line interconnects through microwave measurements
    • Oct.
    • J. Kim and D. Neikirk, "Experimental characterization of copper/low-k transmission line interconnects through microwave measurements," in Electrical Performance of Electronic Packaging, 2003, Oct. 2003, pp. 93-96.
    • (2003) Electrical Performance of Electronic Packaging, 2003 , pp. 93-96
    • Kim, J.1    Neikirk, D.2
  • 19
    • 0026908091 scopus 로고
    • S-parameter-based IC interconnect transmission line characterization
    • DOI 10.1109/33.159877
    • W. Eisenstadt and Y. Eo, "S-parameter-based ic interconnect transmission line characterization," Components, Hybrids, and Manufacturing Technology, IEEE Transactions on, vol. 15, no. 4, pp. 483-490, Aug 1992. (Pubitemid 23555802)
    • (1992) IEEE transactions on components, hybrids, and manufacturing technology , vol.15 , Issue.4 , pp. 483-490
    • Eisenstadt, W.1    Eo, Y.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.