Experimental characterization of copper/low-k transmission line interconnects through microwave measurements

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 93-96

  Kim, Jooyong ^a   Neikirk, D P ^a  

^a The University of Texas at Austin   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; MICROWAVE MEASUREMENT; SCATTERING PARAMETERS;

EXPERIMENTAL CHARACTERIZATION; LOSS TANGENT; LOW K DIELECTRICS; RELATIVE DIELECTRIC CONSTANT;

DIELECTRIC MATERIALS;

EID: 33749511390     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250007     Document Type: Conference Paper

References (9)

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