Post-CMOS packaging methods for integrated biosensors

Proceedings of IEEE Sensors

Volumn , Issue , 2009, Pages 795-798

  Dandin, Marc ^a   Jung, Im Deok ^a   Piyasena, Menake ^a   Gallagher, James ^b   Nelson, Nicole ^a   Urdaneta, Mario ^a   Artis, Chantelle ^c   Abshire, Pamela ^a   Smela, Elisabeth ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b Tulane University   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIOLOGICAL ENVIRONMENTS; CERAMIC PACKAGE; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; COMPLEX STRUCTURE; ENCAPSULANTS; HIGH ASPECT RATIO STRUCTURES; INTEGRATED BIOSENSOR; MICROFLUIDIC NETWORKS; NEGATIVE TONES; PACKAGING METHODS; PHOTOCURABLE RESINS; POST-CMOS; RE-ROUTING; WIRE BONDS;

ASPECT RATIO; BIOSENSORS; CELL CULTURE; CMOS INTEGRATED CIRCUITS; DIES; ELECTRONIC EQUIPMENT MANUFACTURE; RESINS;

CHIP SCALE PACKAGES;

EID: 77951117738     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2009.5398540     Document Type: Conference Paper

References (8)

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