InP-based membrane couplers for optical interconnects on Si

IEEE Photonics Technology Letters

Volumn 21, Issue 5, 2009, Pages 337-339

  Binetti, Pietro R A ^a   Orobtchouk, Regis ^b   Leijtens, Xaveer J M ^a   Han, Bing ^b   De Vries, T ^a   Oei, Yoki Siang ^a   Di Cioccio, Lea ^c   Fedeli, Jean Marc ^c   Lagahe, Chrystelle ^d   Van Veldhoven, P J ^a   Nötzel, Richard ^a   Smit, Meint K ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b UNIVERSITÉ DE LYON   (France)

^c CEA GRENOBLE   (France)

^d TRACIT Technologies   (France)

Author keywords

Bonding; Flip chip devices; Optical interconnections

Indexed keywords

BONDING; III-V SEMICONDUCTORS; INDIUM PHOSPHIDE; INTEGRATED CIRCUIT INTERCONNECTS; OPTICAL INTERCONNECTS; PHOTONIC DEVICES; SEMICONDUCTING INDIUM PHOSPHIDE; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; WAFER BONDING; WSI CIRCUITS;

FUTURE GENERATIONS; INTEGRATED-CIRCUIT PROCESSING; MEMBRANE LAYERS; PHOTONIC DEVICE FABRICATION; SILICON ON INSULATOR WAFERS; WAFER-SCALE PROCESSING;

FLIP CHIP DEVICES;

EID: 77951072220     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2008.2011649     Document Type: Article

References (7)

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