SiC power devices: Product improvement using diffusion soldering

Materials Science Forum

Volumn 615 617, Issue , 2009, Pages 613-616

  Holz, Matthias ^a   Hilsenbeck, Jochen ^b   Otremba, Ralf ^a   Heinrich, Alexander ^a   Türkes, Peter ^a   Rupp, Roland ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

Author keywords

Assembly; Die attach; Diffusion soldering; Reliability; Schottky diodes

Indexed keywords

ASSEMBLY; DIFFUSION; RELIABILITY; SCHOTTKY BARRIER DIODES; SILICON CARBIDE; SOLDERING; THERMAL CONDUCTIVITY;

DIE-ATTACH; DIE-ATTACH MATERIALS; DIFFUSION SOLDERING; HIGH VOLTAGE APPLICATIONS; MARKET PENETRATION; PRODUCT IMPROVEMENT; SCHOTTKY DIODES; SWITCH-MODE POWER SUPPLIES;

POWER SEMICONDUCTOR DEVICES;

EID: 77951017282     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.615-617.613     Document Type: Conference Paper

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