Regular Cu-based amorphous alloy powder

Journal of Alloys and Compounds

Volumn 497, Issue 1-2, 2010, Pages 234-238

  Cai, An hui ^a,b   Xiong, Xiang ^a   Liu, Yong ^a   Zhou, Yong ^b   An, Wei ke ^b   Luo, Yun ^b  

^a CENTRAL SOUTH UNIVERSITY   (China)

^b HUNAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Amorphous alloy; Ball milling; Mechanism; Nanometer plate; Superplasticity

Indexed keywords

AMORPHOUS ALLOY POWDERS; AMORPHOUS STRUCTURES; CU-BASED; DEFORMATION MECHANISM; DEFORMATION RATIO; MECHANICAL ENERGIES; METAL ELEMENTS; MILLING TIME; NANOMETER PLATE; TEMPERATURE FIELD; UNDERCOOLED LIQUID REGION;

AMORPHIZATION; AMORPHOUS ALLOYS; CERIUM ALLOYS; COPPER ALLOYS; DEFORMATION; MILLING (MACHINING); MILLING MACHINES; PLATES (STRUCTURAL COMPONENTS); POWDER METALS; STRESSES; SUPERPLASTICITY; THERMODYNAMICS; ZIRCONIUM;

BALL MILLING;

EID: 77950960619     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.03.018     Document Type: Article

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