Finite element simulation of inkjet printed strain gage on polyimide substrates applied to flexible boards

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 607-611

  Silva, Edson R ^a,c   Oliveira, W C ^a,c   Arruda, L O ^a,b   Bonadiman, R ^a   Quintero, J ^a   Mancosu, R ^a   Silva Neto, J M ^a  

^a Nokia Technology Institute (INdT)   (Brazil)

^b UNIVERSIDADE DO ESTADO DO AMAZONAS   (Brazil)

^c FEDERAL UNIVERSITY OF AMAZONAS   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT METHOD; FEM SIMULATIONS; FINITE ELEMENT SIMULATIONS; FLEXIBLE PRINTED BOARD; MECHANICAL STRAIN; NUMERICAL MODELING; POLYIMIDE SUBSTRATE; PRINTED STRAIN GAGES; SIMULATION MODEL; STRAIN DEFORMATION; STRAIN GAUGE; STRESS BEHAVIOR;

DEFORMATION; ELECTRONICS PACKAGING; FLEXIBLE STRUCTURES; POLYIMIDES; PRODUCT DESIGN; STRAIN GAGES;

FINITE ELEMENT METHOD;

EID: 77950960232     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416476     Document Type: Conference Paper

References (8)

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