On the simulation of flexible circuit boards

16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007

Volumn , Issue , 2007, Pages 447-451

  Arruda, Luciano ^a  

^a Nokia Technology Institute (INdT)   (Brazil)

Author keywords

Drop tests; FEM; Flex printed circuit boards; Four point bend tests

Indexed keywords

BASE MATERIAL; CRITICAL LOAD; DROP TEST; FLEXIBLE CIRCUIT BOARDS; FLEXIBLE PRINTED CIRCUIT BOARDS; FOUR POINT BEND TESTS; IMPACT LOADS; RELIABILITY CHARACTERISTICS;

COMPUTER SIMULATION; DROPS; EXHIBITIONS; FINITE ELEMENT METHOD; MICROELECTRONICS; POLYIMIDES;

PRINTED CIRCUIT BOARDS;

EID: 84875323674     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, California, May 30 - June 2, pp. 1299-1304, 2005.
2. A. Ptchelintsev, "Fatigue Analysis andOptimization of Flexible Printed Circuits",Proceedings of the 2006 Abaqus usersConference (ECTC), Lake Buena Vista, California, May 30 - June 2, pp. 1-12, 2006.
3. Clyde F. Coombs Jr, "Printed Circuits Handbook", McGraw Hill (2001), pp. 56.3 - 56.6.
4. ANSYS, "Electronics Manual". Version 11.0. 2007. USA.
5. ABAQUS, "Electronics Manual". Version 6.63 2007. USA.
6. th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, California, May 30 - June 2, pp. 665-673, 2005.
7. LLE, "The Properties of Polyimide Targets". University of Rochester - Laboratory for Laser Energetics. LLE Review - Quarterly Report. Vol. 92. July-September. (2002), pp. 167-180.
8. JEDEC, "Board Level Drop Test Method of Components for Handheld Electronic Products" JESD22-B11. JEDEC Solid State Technology Association, (July 2003), USA.