Adhesive bonding of polymeric microfluidic devices

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 737-740

  Goh, C S ^a   Tan, S C ^a   May, K T ^a   Chan, C Z ^a   Ng, S H ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE BONDING; DIFFERENT SUBSTRATES; MICROFLUIDIC CHANNEL; PEEL TESTS; POLYMERIC MICROFLUIDIC DEVICES; PRESSURE SENSITIVE; PRESSURE SENSITIVE ADHESIVES; PRESSURE TESTS; UV CURABLE ADHESIVE;

ELECTRONICS PACKAGING; FLUIDIC DEVICES; MICROFLUIDICS; PEELING;

POLYMERS;

EID: 77950931643     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416452     Document Type: Conference Paper

References (5)

1. Lee, S., Jiang, Y., "Integrated plastic microfluidic devices with ESI-MS for drug screening", Analytical Chemistry, Vol 73, (2001), pp. 2048-2053.
2. Locascio, L., Perso, C., "Measurement of electroosmotic flow in plastic imprinted microfluid devices", J. Chromatography A, Vol 857, (1999), pp. 275-284.
3. Glasgow, I. K., Beebee, D. J., White, V.E., "Design rules for polyimide solvent bonding", Sensors and Materials, Vol 11, (1999), pp. 269-278.
4. Becker, H., Gartner, C., "Polymer microfabrication technologies for microfluidic systems", Vol 390, (2008), pp. 89-111.
5. Huang, F.C., Chen, Y.F., Lee, G.B., "CE chips fabricated by injection molding and polyethylene/thermoplastic elastomer film packaging methods", Electrophoresis, Vol 28, (2007), pp. 1130-1137.