Quick wafer alignment using feedforward neural networks

IEEE Transactions on Automation Science and Engineering

Volumn 7, Issue 2, 2010, Pages 377-382

  Kim, HyungTae ^a   Lee, KangWon ^a   Jeon, BongKeon ^b   Song, ChangSeop ^b  

^a Korea Institute of Industrial Technology   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

Auto loading; Automatic alignment; Dicing process; Precise stage; Semiconductor manufacturing automation; Wafer mounting

Indexed keywords

AUTOMATIC ALIGNMENT; DICING PROCESS; SEMICONDUCTOR MANUFACTURING; SEMICONDUCTOR MANUFACTURING AUTOMATION; WAFER MOUNTING;

BACKPROPAGATION; DATA FLOW ANALYSIS; FEEDFORWARD NEURAL NETWORKS; KINEMATICS; SILICON WAFERS;

ALIGNMENT;

EID: 77950866263     PISSN: 15455955     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASE.2009.2024243     Document Type: Article

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