메뉴 건너뛰기




Volumn Part F133492, Issue , 1998, Pages 109-110

High reliability, high density, low cost packaging systems for matrix BGA and CSP using VPES (vacuum printing encapsulation systems)

(1)  Okuno, A a  

a IEEE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; COSTS; EPOXY RESINS; METAL MOLDING; NETWORK COMPONENTS; PACKAGING MACHINES; RELIABILITY; TRANSFER MOLDING; COST EFFECTIVENESS; ENCAPSULATION; VACUUM APPLICATIONS;

EID: 0031640738     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678678     Document Type: Conference Paper
Times cited : (17)

References (7)
  • 2
    • 0028374988 scopus 로고
    • Printing encapsulation systems (PES) of advanced multichip module and cob device
    • Atsushi Okuno, etc., "Printing Encapsulation Systems (PES) of Advanced Multichip Module and COB Device", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 17, No. 1, pp. 143-150, 1994.
    • (1994) IEEE Transactions on Components, Packaging and Manufacturing Technology , vol.17 , Issue.1 , pp. 143-150
    • Atsushi, O.1
  • 3
    • 0009554876 scopus 로고
    • PES (Printing Encapsulation Systems) of some BGA Packaging
    • Atsushi Okuno, etc., "PES (Printing Encapsulation Systems) of some BGA Packaging", ISHM '96, Proceedings, pp. 103-106, 1994.
    • (1994) ISHM '96, Proceedings , pp. 103-106
    • Atsushi, O.1
  • 4
    • 84954239540 scopus 로고    scopus 로고
    • Properties and reliability of liquid epoxy resin for LSI Fabrication with PES (Printing Encapsulation Systems
    • Sept.
    • Atsushi Okuno, etc., "Properties and Reliability of Liquid Epoxy Resin for LSI Fabrication with PES (Printing Encapsulation Systems)", Electronics and Communications in Japan, Part 2, Vol. J79-C-II, No. 9, pp. 431-439, Sept., 1996.
    • (1996) Electronics and Communications in Japan, Part 2, J79-C-II , Issue.9 , pp. 431-439
    • Atsushi, O.1
  • 5
    • 0029239515 scopus 로고
    • Flip-Chip packaging using PES (Printing Encapsulation Systems) and PES's under-fill epoxy resin
    • May
    • Atsushi Okuno, "Flip-Chip Packaging Using PES (Printing Encapsulation Systems) and PES's Under-fill Epoxy Resin", 45th, Electronic Components and Technology Conference, pp. 1240-1243, May, 1995.
    • (1995) 45th, Electronic Components and Technology Conference , pp. 1240-1243
    • Atsushi, O.1
  • 6
    • 85053928600 scopus 로고    scopus 로고
    • Atsushi Okuno, etc., US P 5, 232, 651
    • US P , vol.5 , Issue.232 , pp. 651
    • Atsushi, O.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.