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Volumn Part F133492, Issue , 1998, Pages 109-110
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High reliability, high density, low cost packaging systems for matrix BGA and CSP using VPES (vacuum printing encapsulation systems)
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Author keywords
[No Author keywords available]
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Indexed keywords
BALL GRID ARRAYS;
COSTS;
EPOXY RESINS;
METAL MOLDING;
NETWORK COMPONENTS;
PACKAGING MACHINES;
RELIABILITY;
TRANSFER MOLDING;
COST EFFECTIVENESS;
ENCAPSULATION;
VACUUM APPLICATIONS;
DIMENSIONAL ACCURACY;
FLUX COATING;
HIGH RELIABILITY;
LOW-COST PACKAGING;
PACKAGING PROCESS;
PRINTING TECHNOLOGIES;
VACUUM PRINTING ENCAPSULATION SYSTEMS;
VPES (VACUUM PRINTING ENCAPSULATION SYSTEMS);
PACKAGING;
ELECTRONICS PACKAGING;
BALL GRID ARRAYS (BGA);
CHIP SCALE PACKAGES (CSP);
VACUUM PRINTING ENCAPSULATION SYSTEMS (VPES);
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EID: 0031640738
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.1998.678678 Document Type: Conference Paper |
Times cited : (17)
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References (7)
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