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Volumn , Issue , 2009, Pages 85-88
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ACP Mfg. Tech. for rigid & flex board interconnection
a
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Author keywords
[No Author keywords available]
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Indexed keywords
AFTER-HEAT;
ALTERNATIVE MATERIALS;
ANISOTROPIC CONDUCTIVE FILMS;
ANISOTROPIC CONDUCTIVE PASTES;
BONDING METHODS;
BONDING PARAMETERS;
BONDING PROCESS;
BONDING TEMPERATURES;
BONDING TIME;
CHIP ON FLEXES;
CONDUCTIVE ADHESIVE;
CONDUCTIVE PARTICLE;
CONDUCTIVE PASTES;
DESIGN LAYOUT;
DIFFERENT PROCESS;
DISTRIBUTION CONTROL;
DRIVING FORCES;
ELECTRICALLY CONDUCTIVE;
ENVIRONMENT-FRIENDLY MATERIALS;
ENVIRONMENTAL TEMPERATURE;
FABRICATION METHODOLOGY;
FINE PITCH;
FINGER PRINT;
FLEX- BOARD;
FLIP CHIP;
GOLD BUMPS;
INITIAL STAGES;
LEAD-FREE;
LIQUID CRYSTAL DISPLAY DRIVERS;
LOW COSTS;
LOWER COST;
MANUFACTURING METHODS;
MANUFACTURING TECHNOLOGIES;
MATERIAL COST;
ORGANIC BOARDS;
ORGANIC SUBSTRATE;
PARTICLE DENSITIES;
PEEL STRENGTH;
PEELING STRENGTH;
RELIABILITY TEST;
SCREEN PRINTING PASTE;
SIZE SELECTION;
SOLDER MASK;
THERMAL STABILITY;
THERMOPLASTIC RESIN;
ULTRA FINE PITCH;
VOLUME CONTROLS;
ANISOTROPY;
CONDUCTIVE FILMS;
COSTS;
GAIN CONTROL;
LIQUID CRYSTAL DISPLAYS;
LIQUID CRYSTALS;
PRESSES (MACHINE TOOLS);
PRINTING PRESSES;
REINFORCED PLASTICS;
RESINS;
SCREEN PRINTING;
THERMOGRAVIMETRIC ANALYSIS;
THERMOSETS;
THREE DIMENSIONAL;
MATERIALS;
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EID: 77950792039
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2009.5382173 Document Type: Conference Paper |
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Times cited : (2)
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References (3)
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