Through silicon via stress characterization

2009 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2009

Volumn , Issue , 2009, Pages 39-41

  Dao, Thuy ^b   Triyoso, Dina H ^b   Petras, Mike ^a   Canonico, Michael ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN CONSIDERATIONS; MICRO-RAMAN; THROUGH SILICON VIAS; THROUGH-SILICON-VIA;

DESIGN; INTEGRATED CIRCUITS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 77950326936     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICICDT.2009.5166260     Document Type: Conference Paper

References (4)

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2. S. Denda, Polytronic 2007 Conference, pp. 149-152.
3. R. Wieland, D. Bonfert, A. Klumpp, R. Merkel, L. Nebrich, J. Weber and P. Ramm, Microelectronic Engineering 82 (2005) p. 529-533 (2005).
4. E. Anastassakis, A. Cantarero, and M. Cardona, Phys. Rev. B, 41, 7529 (1990).