Thermal stress and thermomechanical simulation of embedded electronic packaging

International Journal of Nanomanufacturing

Volumn 1, Issue 4, 2007, Pages 516-523

  Islam, M D ^a   Kelly, Ger ^a  

^a Department of Chemistry   (Ireland)

Author keywords

embedded; interconnect; thermal stress; thermomechanical

Indexed keywords

EID: 77949613001     PISSN: 17469392     EISSN: 17469406     Source Type: Journal    
DOI: 10.1504/IJNM.2007.014571     Document Type: Article

References (8)

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