A new supplier performance evaluation model: A case study of integrated circuit (IC) packaging companies

Kybernetes

Volumn 39, Issue 1, 2010, Pages 37-54

  Kang, He Yau ^a   Lee, Amy H I ^b  

^a NATIONAL CHIN YI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b CHUNG HUA UNIVERSITY   (Taiwan)

Author keywords

Analytic hierarchy process; Cybernetics; Data analysis; Packaging; Semiconductors; Supplier evaluation

Indexed keywords

ANALYTIC HIERARCHY PROCESS; CYBERNETICS; DATA ENVELOPMENT ANALYSIS; DATA REDUCTION; FACTOR ANALYSIS; HIERARCHICAL SYSTEMS; PACKAGING; SEMICONDUCTOR MATERIALS; SUPPLY CHAINS; TIMING CIRCUITS;

ANALYTIC HIERARCHY PROCESS (AHP); DESIGN/METHODOLOGY/APPROACH; INTEGRATED CIRCUIT PACKAGING; PAIR-WISE COMPARISON; PERFORMANCE CHARACTERISTICS; SUPPLIER EVALUATION AND SELECTIONS; SUPPLIER EVALUATIONS; SUPPLIER PERFORMANCE EVALUATIONS;

INTEGRATED CIRCUITS;

EID: 77949555761     PISSN: 0368492X     EISSN: None     Source Type: Journal    
DOI: 10.1108/03684921011021264     Document Type: Article

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