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Volumn 322, Issue 9-12, 2010, Pages 1592-1596
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Deposition of thick Co-rich CoPtP films with high energy product for magnetic microelectromechanical applications
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Author keywords
Electrodeposited CoPtP micro magnet; High energy product; Pulse reverse plating technique; Thick hard magnetic material
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Indexed keywords
COERCIVITIES;
COLUMNAR STRUCTURES;
CRYSTALLINE STRUCTURE;
ELECTROPLATED FILMS;
ENERGY PRODUCTS;
GRAIN SIZE;
HARD MAGNETIC MATERIAL;
HIGH ENERGY PRODUCTS;
MAGNETIC MEMS;
MICRO-ELECTRO-MECHANICAL;
MICROMAGNETS;
PERPENDICULAR ANISOTROPY;
PERPENDICULAR COERCIVITY;
PLATED FILMS;
PULSE REVERSE PLATING;
SEED LAYER;
VARYING THICKNESS;
ADDITIVES;
ANISOTROPY;
COBALT;
COERCIVE FORCE;
CORROSION;
ELECTRODEPOSITION;
HIGH ENERGY PHYSICS;
MAGNETIC MATERIALS;
MAGNETS;
REMANENCE;
SATURATION MAGNETIZATION;
MAGNETIC THICK FILMS;
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EID: 77949281434
PISSN: 03048853
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jmmm.2009.09.032 Document Type: Article |
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Times cited : (22)
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References (25)
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