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Volumn 16, Issue 1, 2010, Pages 130-139
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Humic acid-immobilized polymer/bentonite composite as an adsorbent for the removal of copper(II) ions from aqueous solutions and electroplating industry wastewater
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Author keywords
Copper(II) adsorption; Humic acid; Isotherm; Polymer clay composite; Thermodynamics
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Indexed keywords
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EID: 77249147812
PISSN: 1226086X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jiec.2010.01.006 Document Type: Article |
Times cited : (59)
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References (35)
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