Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 1590-1593

  Svoboda, Miloš ^a   Slouka, Zdeněk ^a   Schrott, Walter ^a   Červenka, Petr ^a   Přibyl, Michal ^a   Šnita, Dalimil ^a  

^a INSTITUTE OF CHEMICAL TECHNOLOGY   (Czech Republic)

Author keywords

Micro electrode; Micro electrode array; Sacrificed substrate; Solvent bonding

Indexed keywords

BOND STRENGTH; BONDING AGENT; BONDING TEMPERATURES; CONDUCTOMETERS; FABRICATION PROCESS; GOLD ELECTRODEPOSITION; GOLD ELECTRODES; GOLD MICROELECTRODES; GOLD STRUCTURES; ISOPROPYL ALCOHOLS; MICRO DEVICES; MICRO MILLING; MICROELECTRODE ARRAY; MICROFLUIDIC CHANNEL; MICROFLUIDIC CHIP; SACRIFICED SUBSTRATE; SOLVENT BONDING; SUBSTRATE SOLVENT; THERMAL BONDING; THERMALLY ACTIVATED; UV CURABLE; WHOLE PROCESS;

BOND STRENGTH (MATERIALS); FABRICATION; FLUIDIC DEVICES; MICROELECTRODES; MICROFLUIDICS; RESINS; SOLVENTS; SUBSTRATES;

GOLD;

EID: 76949107461     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.11.010     Document Type: Article

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