Dynamic thermal mechanical characterization of Epoclad negative photoresist for micro mechanical structures

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 1278-1280

  Wouters, Kristof ^a   De Doncker, Hendrik ^a   Puers, Robert ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Epoclad; Mechanical properties; Polymer MEMS

Indexed keywords

GLASS TRANSITION TEMPERATURE; LOSS MODULI; MECHANICAL CHARACTERIZATIONS; MICROMECHANICAL STRUCTURES; NEGATIVE PHOTORESISTS; PHOTO-DEFINABLE; POLYMER MEMS; STORAGE MODULI; STRUCTURAL LAYERS; THERMAL MECHANICAL CHARACTERIZATION; THERMAL MECHANICAL PROPERTIES; VISCOELASTIC PROPERTIES;

GLASS TRANSITION; MEMS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTORS; SURFACE TREATMENT;

MECHANICAL PROPERTIES;

EID: 76949091727     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.10.031     Document Type: Article

References (5)

1. Schroder H., et al. Proceedings of SPIE 6124 (2006) 612407
2. K. Wouters, R. Puers, Young's modulus measurement and creep behavior of three different photo-definable epoxies for micro-fabrication, in: Proceedings of the EurosensorsXXII, Dresden, Germany, 7-10 September 2008, p. 835.
3. K. Wouters, R. Puers, Measurement of internal stress and coefficient of thermal expansion of epoclad negative photo resist, in: Proceedings of the MME'08, Aachen, 2008, p. 247.
4. Park J.R. Polymer science and technology. second ed. (2007), Prentice Hall Books, Upper Saddle River p. 242
5. Park S.W., and Schapey R.A. International Journal of Solids and Structures 36 (1999) 1653