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Volumn 42, Issue 2, 2010, Pages 95-101

Interface analysis of pure Sn, pure Ag and Sn-Ag binary alloys in H 2SO4

Author keywords

A.c. impedance; CPE; H2SO4; Open circuit potential; Sn Ag alloys

Indexed keywords

A.C. IMPEDANCE SPECTROSCOPY; ACID CONCENTRATIONS; CONSTANT THICKNESS; CORROSION POTENTIALS; ELECTROCHEMICAL IMPEDANCE; EXPONENTIAL VARIATION; INTERFACE ANALYSIS; OPEN-CIRCUIT POTENTIAL; PASSIVATION PROPERTIES; PASSIVE FILMS; POROUS LAYERS; POTENTIODYNAMIC CURVE; PURE SN; SATURATED CALOMEL ELECTRODE; SN-AG ALLOYS; SOLID-PHASE; SURFACE FILMS; THIN BARRIER LAYERS;

EID: 76749085767     PISSN: 01422421     EISSN: 10969918     Source Type: Journal    
DOI: 10.1002/sia.3160     Document Type: Article
Times cited : (5)

References (31)
  • 1
    • 76749134447 scopus 로고    scopus 로고
    • Tin plating,tin-nickel electroplate and tin plating over nickel as final finishes on copper
    • Sep 10-12; San Jose, CA
    • P. Hinton, Tin plating,tin-nickel electroplate and tin plating over nickel as final finishes on copper, in Proceedings of the Technical Program, Surface Mount International; Sep 10-12; San Jose, CA, 1996, pp 806.
    • (1996) Proceedings of the Technical Program, Surface Mount International , pp. 806
    • Hinton, P.1
  • 10
    • 76749139629 scopus 로고
    • U. S. 2
    • Alan Coudray Sim, U. S. 2, 1961, 985, 807.
    • (1961) Alan Coudray Sim , vol.985 , pp. 807


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.