|
Volumn , Issue , 2009, Pages 541-546
|
Influence of powder properties and plasma spray conditions on erosion resistance of yttrium oxide coatings against halogen plasma for dry etching process in semiconductor and electronic applications
|
Author keywords
[No Author keywords available]
|
Indexed keywords
CHAMBER WALLS;
COATING PROPERTIES;
DEVICE INTEGRATION;
DRY ETCHING PROCESS;
ELECTRONIC APPLICATION;
ELECTRONIC DEVICE;
EROSION PROPERTIES;
EROSION RESISTANCE;
FINE POWDERS;
HALOGEN PLASMAS;
PARTICLE GENERATION;
PLASMA SPRAY;
POWDER PROPERTIES;
PRIMARY PARTICLE SIZE;
PROCESS PARAMETERS;
PRODUCTION EFFICIENCY;
SINTERED POWDERS;
ALUMINUM COATINGS;
DRY ETCHING;
MECHANICAL PROPERTIES;
PLASMA ETCHING;
PLASMA JETS;
PLASMA SPRAYING;
PLASMAS;
POWDER COATINGS;
PROTECTIVE COATINGS;
SEMICONDUCTOR DEVICES;
SHIELDING;
SINTERING;
YTTRIUM;
YTTRIUM OXIDE;
YTTRIUM ALLOYS;
|
EID: 76649145683
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1361/cp2009itsc0541 Document Type: Conference Paper |
Times cited : (2)
|
References (6)
|