Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives

Sadhana - Academy Proceedings in Engineering Sciences

Volumn 34, Issue 5, 2009, Pages 799-810

  Durairaj, R ^a   Mallik, S ^b   Seman, A ^b   Ekere, N N ^b  

^a UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Isotropic conductive adhesives; Rheology; Solder paste; Stencil printing process; Wall slip

Indexed keywords

DEPLETION EFFECTS; FLOW BEHAVIOURS; FLOW GEOMETRIES; GAP HEIGHT; ISOTROPIC CONDUCTIVE ADHESIVES; LEAD-FREE SOLDER PASTE; PARALLEL PLATE GEOMETRY; PARALLEL PLATES; PASTE VISCOSITY; ROUGH SURFACES; SOLDER PASTE STENCIL PRINTING; STRUCTURAL BREAKDOWN; WALL-SLIP; WALL-SLIP EFFECTS;

CONDUCTIVE MATERIALS; ELASTICITY; GEOMETRY; LEAD; MICROSTRUCTURE; PLASTICITY; PLATES (STRUCTURAL COMPONENTS); PRINTING; PRINTING PRESSES; RHEOLOGY; SLIP FORMING; SOLDERING; SURFACE PROPERTIES; SURFACE ROUGHNESS; VISCOSITY; WALLS (STRUCTURAL PARTITIONS);

ADHESIVE PASTES;

EID: 76449117110     PISSN: 02562499     EISSN: 09737677     Source Type: Journal    
DOI: 10.1007/s12046-009-0046-5     Document Type: Article

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