Two-and three-dimensional transient thermoelastic analysis by the MLPG method

CMES - Computer Modeling in Engineering and Sciences

Volumn 47, Issue 1, 2009, Pages 61-95

  Sladek, J ^a   Sladek, V ^a   Solek, P ^b   Tan, C L ^c   Zhang, Ch ^d  

^a INSTITUTE OF CONSTRUCTION AND ARCHITECTURE   (Slovakia)

^b SLOVAK UNIVERSITY OF TECHNOLOGY   (Slovakia)

^c CARLETON UNIVERSITY   (Canada)

^d UNIVERSITY OF SIEGEN   (Germany)

Author keywords

Crack problems; Functionally graded materials; Houbolt finite difference scheme; Moving least squares interpolation; Orthotropic materials; Transient thermoelasticity

Indexed keywords

CRACK PROBLEMS; FINITE-DIFFERENCE SCHEME; HEAT CONDUCTION EQUATIONS; HEAVISIDE STEP FUNCTION; LOCAL INTEGRAL EQUATIONS; MESHLESS LOCAL PETROV-GALERKIN METHOD; MLPG METHOD; MOVING LEAST SQUARES; MOVING LEAST-SQUARES INTERPOLATION; NODAL POINTS; ORTHOTROPIC MATERIAL PROPERTIES; ORTHOTROPIC MATERIALS; SECOND ORDERS; SPATIAL VARIATIONS; SPHERICAL SHAPE; SUB-DOMAINS; SYSTEM OF ORDINARY DIFFERENTIAL EQUATIONS; TEMPERATURE FIELD; TEST FUNCTIONS; THERMOELASTIC ANALYSIS; THREE-DIMENSIONAL PROBLEMS; TIME STEPPING METHOD; UNCOUPLED THERMOELASTICITY;

BEAMS AND GIRDERS; CRACK INITIATION; CRACKS; DIFFERENCE EQUATIONS; ELASTICITY; EQUATIONS OF MOTION; HEAT CONDUCTION; INTEGRAL EQUATIONS; INTERPOLATION; MECHANICS; ORDINARY DIFFERENTIAL EQUATIONS; THERMOELASTICITY; THREE DIMENSIONAL;

FUNCTIONALLY GRADED MATERIALS;

EID: 76449112811     PISSN: 15261492     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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