Effect of bond thickness on the fracture toughness and the strain field around a crack tip in adhesive joints using epoxy resin modified with solid rubber particles

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 75, Issue 759, 2009, Pages 1516-1525

  Ueda, Masahiro ^a   Shishido, Nobuyuki ^b   Ikeda, Toru ^b   Miyazaki, Noriyuki ^b  

^a KYOTO UNIVERSITY   (Japan)

^b NONE

Author keywords

Adhesive joint; Digital image correlation method; Finite element method; Fracture mechanics; Rubber modified epoxy resin

Indexed keywords

ADHESIVE JOINTS; CORRELATION METHODS; CRACK PROPAGATION; CRACK TIPS; CRACKS; DUCTILE FRACTURE; EPOXY RESINS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; IMAGE ANALYSIS; RUBBER; STRAIN; STRAIN MEASUREMENT;

ADHESIVE LAYERS; ADHESIVE STRUCTURE; CONSTRAINT EFFECTS; DIGITAL IMAGE CORRELATION METHODS; DUCTILE ADHESIVES; FRACTURE BEHAVIOR; MEASUREMENT AND ANALYSIS; RUBBER-MODIFIED EPOXY RESINS;

FRACTURE TOUGHNESS;

EID: 76349118588     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.75.1516     Document Type: Article

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