Investigation of creep threshold stresses using in situ TEM straining experiment in an Al-5Y2O3-10SiC composite

Materials Science and Engineering: A

Volumn 527, Issue 9, 2010, Pages 2390-2397

  Deshmukh, S P ^a   Mishra, R S ^a   Robertson, I M ^b  

^a University of Missouri Rolla   (United States)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Creep; Dislocation particle interaction; In situ TEM; Threshold stress

Indexed keywords

DISPERSIONS; METALLIC MATRIX COMPOSITES; PARTICLE INTERACTIONS; SILICON COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY;

CREEP BEHAVIORS; CREEP RATES; DETACHMENT STRESS; DISLOCATION-PARTICLE INTERACTION; DISPERSION STRENGTHEN; DISPERSION STRENGTHENED ALLOY; IN-SITU TEM; MATRIX COMPOSITE; METAL MATRIX; THRESHOLD STRESS;

CREEP;

EID: 76049110033     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2009.12.015     Document Type: Article

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