Modeling the structural breakdown of solder paste using the structural kinetic model

Journal of Materials Engineering and Performance

Volumn 19, Issue 1, 2010, Pages 40-45

  Mallik, S ^a   Ekere, N N ^a   Marks, A E ^a   Seman, A ^a   Durairaj, R ^a,b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

Author keywords

Advanced characterization; Electronic materials; Modeling processes

Indexed keywords

APPARENT VISCOSITY; BONDING MATERIALS; CONSTANT SHEAR; ELECTRONIC INDUSTRIES; ELECTRONIC MATERIALS; FLIP CHIP ASSEMBLIES; FLOW BEHAVIORS; FLOW PROPERTIES; FLUX MEDIUM; NETWORK STRUCTURES; NON-NEWTONIAN; NOVEL METHODS; PASTE FORMULATIONS; PASTE PRINTING; PHYSICAL PARAMETERS; RHEOLOGICAL BEHAVIORS; SHEAR RATES; SOLDER PASTE; STRUCTURAL BREAKDOWN; STRUCTURAL KINETICS; SURFACE MOUNT DEVICE; THIXOTROPIC BEHAVIOR; TIME-DEPENDENT;

CUSTOMER SATISFACTION; ELECTRONIC EQUIPMENT MANUFACTURE; NON NEWTONIAN FLOW; RHEOLOGY; STRATEGIC MATERIALS; TOTAL QUALITY MANAGEMENT; VISCOSITY;

SHEAR DEFORMATION;

EID: 75949127131     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-009-9448-0     Document Type: Article

References (9)

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