Grain boundary diffusion in recrystallizing nanocrystalline materials

Defect and Diffusion Forum

Volumn 289-292, Issue , 2009, Pages 641-648

  Klinger, L ^a   Amouyal, Y ^b   Divinski, S V ^c   Rabkin, E ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b Northwestern University   (United States)

^c UNIVERSITY OF MÜNSTER   (Germany)

Author keywords

Copper alloys; Grain boundaries (GBs); Grain boundary diffusion; Recrystallization

Indexed keywords

COPPER ALLOYS; CRYSTALLIZATION; DIFFUSION; EQUAL CHANNEL ANGULAR PRESSING; GRAIN BOUNDARIES; NANOCRYSTALS; PRESSING (FORMING); RADIOACTIVE TRACERS; RECRYSTALLIZATION (METALLURGY);

GRAIN-BOUNDARY DIFFUSION; PENETRATION PROFILES; ULTRAFINE-GRAIN COPPER;

NANOCRYSTALLINE MATERIALS;

EID: 75949092772     PISSN: 10120386     EISSN: 16629507     Source Type: Journal    
DOI: 10.4028/www.scientific.net/DDF.289-292.641     Document Type: Conference Paper

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