Effect of sintering cooling rate on V segregation amount at WC/Co interface in VC-doped WC-Co fine-grained hardmetal

Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy

Volumn 51, Issue 8, 2004, Pages 576-585

  Kawakami, Masaru ^a   Terada, Osamu ^a   Hayashi, Koji ^b  

^a Fuji Die Co Ltd   (Japan)

^b INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

Author keywords

Grain Growth; Hardmetal; HRTEM; Interface; Segregation; VC

Indexed keywords

COBALT; ELECTRIC DISCHARGES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); NOZZLES; SINTERING;

HETERO-EPITAXIAL NUCLEATION; MULTI-PHASE SYSTEMS; SURFACE PRECISION; THERMAL SHOCK RESISTANCE;

TUNGSTEN CARBIDE;

EID: 7544233506     PISSN: 05328799     EISSN: None     Source Type: Journal    
DOI: 10.2497/jjspm.51.576     Document Type: Article

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