Numerical simulation of the deposition pattern in multiple electrohydrodynamic spraying

Powder Technology

Volumn 198, Issue 3, 2010, Pages 439-444

  Jung, Jae Hee ^a,b   Oh, Hyuncheol ^a,c   Kim, Sang Soo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

^c SAMSUNG Electronics   (South Korea)

Author keywords

Deposition pattern; Electrohydrodynamic spraying; Electrospray; Numerical simulation

Indexed keywords

CAPILLARY-EXTRACTOR-SUBSTRATE CONFIGURATION; CORE REGION; DEPOSITION CHARACTERISTICS; DEPOSITION PATTERN; DEPOSITION PATTERNS; DISPERSION EFFECT; ELECTROSPRAYS; LAGRANGIAN MODELS; MOVING SPEED; NUMERICAL SIMULATION; REPULSIVE INTERACTIONS; SPATIAL DISTRIBUTION; SUBSTRATE VOLTAGE; THICKNESS DISTRIBUTIONS;

ATOMIZERS; DEPOSITION; ELECTROHYDRODYNAMICS; LAGRANGE MULTIPLIERS; MATHEMATICAL MODELS; THREE DIMENSIONAL;

SPRAY NOZZLES;

ARTICLE; DISPERSION; ELECTRIC POTENTIAL; ELECTROSPRAY; FEASIBILITY STUDY; HYDRODYNAMICS; MATHEMATICAL ANALYSIS; MATHEMATICAL MODEL; THICKNESS;

EID: 75049085032     PISSN: 00325910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.powtec.2009.12.006     Document Type: Article

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