|
Volumn 52, Issue 3, 2010, Pages 991-995
|
Galvanic coupling between copper and aluminium in a thin-layer cell
|
Author keywords
A. Alloy; A. Aluminium; A. Copper
|
Indexed keywords
A. ALLOY;
A. ALUMINIUM;
AL ALLOYS;
ALUMINIUM ALLOYS;
ALUMINIUM MATRIX;
COPPER DISSOLUTION;
CORROSION POTENTIALS;
CU ELECTRODE;
ELECTROCHEMICAL QUARTZ CRYSTAL MICROBALANCE;
EXPERIMENTAL SETUP;
GALVANIC CORROSION;
GALVANIC COUPLING;
INTER-METALLIC PARTICLE;
MICROMETER RANGES;
SCANNING ELECTROCHEMICAL MICROSCOPES;
THIN ELECTROLYTE LAYER;
THIN LAYERS;
THIN-LAYER CELLS;
ALUMINUM;
ALUMINUM ALLOYS;
ANALYTIC EQUIPMENT;
COPPER;
COPPER DEPOSITS;
CORROSION;
CYCLIC VOLTAMMETRY;
DISSOLUTION;
ELECTROCHEMICAL ELECTRODES;
OXIDE MINERALS;
QUARTZ;
QUARTZ CRYSTAL MICROBALANCES;
THICKNESS MEASUREMENT;
COPPER ALLOYS;
|
EID: 75049084727
PISSN: 0010938X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.corsci.2009.11.023 Document Type: Article |
Times cited : (46)
|
References (24)
|