Screening and evaluation of different wet cleaning solutions for post etch residue removal in BEOL applications

ECS Transactions

Volumn 25, Issue 5, 2009, Pages 101-107

  Suhard, S ^a   Claes, M ^a   Loh, J ^a   Vereecke, G ^a   Pantouvaki, M ^a   Demuynck, S ^a   Vereecke, B ^a   Beyer, G ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING; EFFICIENCY; ETCHING; ORGANIC SOLVENTS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES;

BACK END OF LINES; CLEAN PROCESS; ELECTRICAL PERFORMANCE; LOW-K MATERIALS; PARTIAL DISSOLUTION; POLYMER REMOVAL; POST-ETCH RESIDUES; SINGLE DAMASCENE;

POLYMERS;

EID: 74949094986     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3202641     Document Type: Conference Paper

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