Thermal conductivity and RF signal transmission properties of Ag-filled epoxy resin

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1383-1390

  Kimura, Tadashi ^a   Nakai, Tsukasa ^a   Ishikawa, Haruo ^a   Ooyama, Chizuko ^a   Oosawa, Keiichi ^a   Kohinata, Shigeru ^a  

^a SUMITOMO METAL MINING CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATTENUATION; CONDUCTIVE PLASTICS; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; MICROSTRIP LINES; SCATTERING PARAMETERS; SILVER; THERMAL CONDUCTIVITY;

METAL-FILLED CONDUCTIVE RESIN; SILVER-FILLED EPOXY RESIN; TRANSMITTIVITY;

EPOXY RESINS;

EID: 0037674393     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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2. Nakai, T. et al, "Measurement of the Thermophysical Properties of the High Concentration Silver filled Epoxy Adhesive", 9th Symp. on Mate2003. (2003) to be published
3. Kimura, T. et al, "The Measurement and the Evaluation of RF Characteristics for the Selected Silver-Filled Epoxy Resins," poster session at The 5th SANKEN International Symposium, Osaka University, Osaka, Japan, March. 2002
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