Properties and curing kinetics of C21-based reactive polyamides as epoxy-curing agents derived from tung oil

Polymer Journal

Volumn 42, Issue 1, 2010, Pages 51-57

  Huang, Kun ^a,b   Xia, Jianling ^a,b   Yang, Xiaohua ^a   Li, Mei ^a   Ding, Haiyang ^a  

^a RESEARCH INSTITUTE OF FORESTRY   (China)

^b State Forestry Administration   (China)

Author keywords

Cure kinetics; Differential scanning calorimetry; Epoxy resin; Mechanical properties; Reactive polyamide

Indexed keywords

AUTOCATALYTIC MODEL; CURE KINETICS; CURED MATERIALS; CURING AGENTS; CURING KINETICS; CURING PROCESS; CURING REACTIONS; DIGLYCIDYL ETHER OF BISPHENOL-A; FLEXURAL MODULUS; FLEXURAL STRENGTH; GLASS TRANSITION TEMPERATURE; ISO-CONVERSIONAL METHOD; NON-ISOTHERMAL DSC; POLYAMINES; PRIMARY AMINES; THEORETICAL CALCULATIONS; THERMAL AND MECHANICAL PROPERTIES; TUNG OIL;

ACTIVATION ENERGY; AMIDES; AMINO ACIDS; CALORIMETERS; DIFFERENTIAL SCANNING CALORIMETRY; DRYING OILS; EPOXY RESINS; ETHERS; GLASS TRANSITION; MECHANICAL PROPERTIES; PHENOLS; POLYAMIDES; RESINS; SCANNING; TENSILE STRENGTH;

CURING;

EID: 74049135293     PISSN: 00323896     EISSN: 13490540     Source Type: Journal    
DOI: 10.1038/pj.2009.303     Document Type: Article

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