Curing kinetics and mechanical properties of epoxy nanocomposites based on different organoclays

Polymer Engineering and Science

Volumn 47, Issue 5, 2007, Pages 649-661

  Ngo, T D ^a   Ton That, M T ^b   Hoa, S V ^a   Cole, K C ^b  

^a Gina Cody School of Engineering and Computer Science   (Canada)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CLAY; EPOXY RESINS; INTERCALATION; MECHANICAL PROPERTIES; PARAMETER ESTIMATION; TRANSMISSION ELECTRON MICROSCOPY;

CURE KINETICS; EXFOLIATION; HEAT EVOLUTION; ORGANOCLAYS;

NANOCOMPOSITES;

EID: 34248223202     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.20737     Document Type: Article

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