Thermal management: Enabling enhanced functionality and reduced carbon footprint

Bell Labs Technical Journal

Volumn 14, Issue 3, 2009, Pages 7-19

  Hernon, Domhnaill ^a   Salamon, Todd ^a   Kempers, Roger ^a   Krishnan, Shankar ^b   Lyons, Alan ^c   Hodes, Marc ^d   Kolodner, Paul ^a   Mullins, John ^a   McGarry, Liam ^a  

^a LUCENT TECHNOLOGIES   (United States)

^b PACIFIC NORTHWEST NATIONAL LABORATORY   (United States)

^c NOKIA RESEARCH CENTER   (United States)

^d TUFTS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIRCONDITIONING SYSTEMS; BELL LABS; CARBON FOOTPRINT; CIRCUIT BOARDS; COMMUNICATIONS EQUIPMENT; COMMUNICATIONS INDUSTRY; ENHANCING HEAT TRANSFER; HEAT DENSITY; HEAT SINK DESIGN; LIQUID COOLING; LOCAL HEAT TRANSFER; OPERATING TEMPERATURE; THERMAL INTERFACE MATERIALS; THERMAL MANAGEMENT; THERMAL RESISTANCE; THERMOELECTRIC MODULES; VORTEX GENERATORS; WASTE-HEAT RECOVERY;

COOLING SYSTEMS; HEAT EXCHANGERS; HEAT RESISTANCE; HEAT TRANSFER; TEMPERATURE CONTROL; THERMOELECTRICITY; WASTE HEAT;

PHASE INTERFACES;

EID: 73349141709     PISSN: 10897089     EISSN: 15387305     Source Type: Journal    
DOI: 10.1002/bltj.20385     Document Type: Article

References (10)

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