|
|
Volumn 286, Issue 1, 2009, Pages 116-124
|
|
Electroless copper sulfide deposition on the polyacrylonitrile films with chelating agents and its EMI shielding effectiveness
a
b
c
b
|
|
Author keywords
Chelating agent; Copper sulfide; Electroless deposition; EMI SE; Swelling
|
|
Indexed keywords
ANCHORING EFFECTS;
CHELATING AGENT;
CONCENTRATION OF;
COPPER SULFIDES;
DEPOSITED LAYER;
ELECTROLESS COPPER;
ELECTROLESS DEPOSITION;
ELECTROMAGNETIC INTERFERENCE SHIELDING EFFECTIVENESS;
EMI SHIELDING EFFECTIVENESS;
ETHYLENE DIAMINE TETRA-ACETIC ACID;
FT-IR SPECTRUM;
HYDROGEN BONDINGS;
REDUCTION AGENTS;
SWELLING DEGREE;
SWELLING EFFECT;
TEA SOLUTION;
TRIETHANOLAMINES;
VINYL ACETATE MONOMERS;
XRD;
CHELATION;
ELECTROLESS PLATING;
ELECTROMAGNETIC COMPATIBILITY;
ELECTROMAGNETIC PULSE;
ELECTROMAGNETIC SHIELDING;
HYDROGEN BONDS;
MAGNETIC SHIELDING;
METAL ANALYSIS;
RADIATION PROTECTION;
SODIUM;
SPONTANEOUS EMISSION;
SWELLING;
COPPER;
|
|
EID: 73149109084
PISSN: 10221360
EISSN: 15213900
Source Type: Journal
DOI: 10.1002/masy.200951215 Document Type: Conference Paper |
|
Times cited : (7)
|
|
References (12)
|
