|
Volumn 5, Issue 11, 2008, Pages 3526-3529
|
Preparation, structural and mechanical properties of electrodeposited Co/Cu multilayers
|
Author keywords
[No Author keywords available]
|
Indexed keywords
[CO/CU];
BILAYER PERIOD;
BILAYER THICKNESS;
CO/CU MULTILAYERS;
COLUMNAR STRUCTURES;
COPPER SUBSTRATES;
CRYSTALLOGRAPHIC ORIENTATIONS;
MODULATED STRUCTURES;
POLYCRYSTALLINE COPPER;
SEM;
SINGLE BATH;
SINGLE LAYER;
STRUCTURAL AND MECHANICAL PROPERTIES;
TEM;
TRIBOLOGICAL TESTS;
WEAR MECHANISMS;
CORROSION;
DEPOSITS;
ELECTRODEPOSITION;
GROWTH (MATERIALS);
INORGANIC COATINGS;
MECHANICAL PROPERTIES;
MULTILAYER FILMS;
NANOSTRUCTURES;
SCANNING ELECTRON MICROSCOPY;
SYNTHESIS (CHEMICAL);
TRANSMISSION ELECTRON MICROSCOPY;
TRIBOLOGY;
X RAY DIFFRACTION;
X RAY DIFFRACTION ANALYSIS;
MULTILAYERS;
|
EID: 72749087343
PISSN: 18626351
EISSN: 16101642
Source Type: Journal
DOI: 10.1002/pssc.200779431 Document Type: Conference Paper |
Times cited : (4)
|
References (9)
|