The effect of micro-alloying of Sn plating on mitigation of Sn whisker growth

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2726-2734

  Dimitrovska, Aleksandra ^a   Kovacevic, Radovan ^a  

^a Southern Methodist University   (United States)

Author keywords

Equiaxed grain structure; Micro alloying of Sn; Pb free; Sn plating; Sn whisker; XRD stress analysis

Indexed keywords

EQUIAXED GRAIN STRUCTURE; PB-FREE; SN PLATING; SN WHISKER; XRD; XRD STRESS ANALYSIS;

ALLOYS; BISMUTH; BISMUTH ALLOYS; COATINGS; COPPER; CRYSTAL MICROSTRUCTURE; CRYSTAL WHISKERS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTROPLATING; GRAIN GROWTH; GRAIN SIZE AND SHAPE; LEAD; METAL CLADDING; MICROALLOYING; STRESS ANALYSIS; STRESS CONCENTRATION; TEXTURES; TIN; TOPOGRAPHY; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; ZINC;

TIN ALLOYS;

EID: 72549089745     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0915-z     Document Type: Article

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