Automatic layout optimization of a double sided power module regarding thermal and EMC constraints

2009 IEEE Energy Conversion Congress and Exposition, ECCE 2009

Volumn , Issue , 2009, Pages 1046-1051

  Mandray, Sylvain ^a,c   Guichon, Jean Michel ^a   Schanen, Jean Luc ^a   Vieillard, Sébastien ^b   Bouzourene, Arezki ^c  

^a LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

^b SAFRAN AIRCRAFT ENGINES   (France)

^c THALES   (France)

Author keywords

Electromagnetic compatibility; Electrothermal effects; Power electronics; Printed circuit layout; Semiconductor device packaging

Indexed keywords

AIRCRAFT APPLICATIONS; AUTOMATIC LAYOUT; AUTOMATICALLY GENERATED; DOUBLE SIDED; ELECTRO-THERMAL EFFECTS; INTEGRATED MODULE; OPTIMIZATION TECHNIQUES; POWER MODULE; PRINTED CIRCUIT LAYOUT; SEMICONDUCTOR DEVICE PACKAGING; THERMAL MODEL; TRADE OFF;

AIRCRAFT; CHIP SCALE PACKAGES; ELECTRIC FUSES; ELECTROMAGNETIC COMPATIBILITY; ENERGY CONVERSION; PLASTIC MOLDS; POWER ELECTRONICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR SWITCHES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 72449190505     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECCE.2009.5316092     Document Type: Conference Paper

References (14)

1. More Open Electrical Technologies project (MOET): www.eurtd.com/moet/PDF/ MOET%20Publishable%20Executive%20S ummary.pdf
2. S.Mandray, JM.Guichon, JL.Schanen, M.Mermet, JM.Dienot, "Electromagnetic considerations for designing double-sided power modules", IEEE IAS'07, 23-27 sept 2007, New Orleans, La, USA
3. M. Mermet Guyennet "New structure of power integrated module", CIPS 2006, Naples, june 06
4. Luechinger, C., "Ribbon Bonding - A Scalable Interconnect for Power QFN Packages", Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th, Volume, Issue, 10-12 Dec. 2007 Page(s):47-54
5. Brucchi, F.; Salvati, P., "Increasing circuit functionality and power density in power hybrids", Power Electronics, IEEE Transactions on, Volume 20, Issue 3, May 2005 Page(s): 671-678
6. Manu Mital, Ying-Feng Pang, and Elaine P. Scott, "Evaluation of Thermal Resistance Matrix Method for an Embedded Power Electronic Module", Components and Packaging Technologies, IEEE Transactions on, Volume 31, Issue 2, June 2008 Page(s):382-387
7. Flotherm, on http://www.flomerics.fr/flotherm/
8. Rebecca 3D on http://www.epsilon-pib.com/?page-id=178
9. B. Revol, J. Roudet, J.L. Schanen, P.Loizelet, "EMI study of a three phase inverter-Fed Motor Drives", IEEE IAS 04, 2-7 octobre 2004, Seattle
10. M. Nave, "EMC in filter design" Van Nostrand Reinhold, New York, 1991.
11. Datasheet IGW25T120: http://igbt.cn/admin/productfile/IGW25T120.pdf
12. E.Bogatin "Design rules for microstrip capacitances" IEEE trans on Components, Hybrids, and manufacturing technologies, vol 1I no3, sept 1988
13. Jean-Luc Schanen, Ludovic Jourdan, James Roudet "Layout Optimization to reduce EMI of a Switched Mode Power Supply", IEEE-PESC'02, 23-27 juin 2002, Queensland, Australia
14. Tobias Wagner1, Nicola Beume, Boris Naujoks "Pareto-, Aggregation and Indicator-Based Methods in Many-Objective Optimization", Evolutionary Multi-Criterion Optimization, Springer 2007, ISBN 978-3-540-70927-5