Evaluation of thermal resistance matrix method for an embedded power electronic module

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 382-387

  Mital, Manu ^a   Pang, Ying Feng ^b   Scott, Elaine P ^c  

^a Virginia Commonwealth University   (United States)

^b INTEL CORPORATION   (United States)

^c SEATTLE PACIFIC UNIVERSITY   (United States)

Author keywords

Finite element analysis (FEA); Integrated power electronic module (IPEM)

Indexed keywords

COOLING CONDITIONS; ELECTRONIC COMPONENTS; ELECTRONIC MODULES; FINITE ELEMENT ANALYSIS (FEA); INPUT POWER; INTEGRATED POWER ELECTRONIC MODULE (IPEM); LINEAR TEMPERATURES; MULTI-CHIP PACKAGES; PACKAGING STRUCTURES; POWER ELECTRONIC MODULES; POWER LOSS; REASONABLE ACCURACIES; RESISTANCE MATRIXES; SUPERPOSITION METHODS; TEMPERATURE RISE; THERMAL CHARACTERIZATIONS; THERMAL PERFORMANCE; THERMAL RESISTANCE MATRIXES; THERMAL RESISTANCES;

CHIP SCALE PACKAGES; FINITE ELEMENT METHOD; FLUID STRUCTURE INTERACTION;

MATRIX ALGEBRA;

EID: 65349168033     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.916836     Document Type: Conference Paper

References (6)

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3. J. W. Sofia, Fundamentals of Thermal Resistance Measurement [Online]. Available: http://www.analysistech.com/downloads/multchip.pdf 1995
4. Y. F. Pang, "Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules," Ph.D. dissertation, Virginia Tech., Blacksburg, 2005.
5. J. V. Beck and K. J. Arnold, Parameter Estimation in Science and Engineering. New York: Wiley, 1977, p. 17.
6. R. V. Hogg and J. Ledolter, Applied Statistics for Engineers and Scientists. New York: Macmillan, 1987.