Microstructure and thermal expansion properties of invar-type Cu-Zn-Al shape memory alloys

Journal of Electronic Materials

Volumn 33, Issue 10, 2004, Pages 1098-1102

  Wang, J J ^a   Omori, T ^b   Sutou, Y ^b   Kainuma, R ^b   Ishida, K ^b  

^a NORTHEASTERN UNIVERSITY   (China)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Cold working; Cu Zn Al; Low thermal expansion (LTE); Martensitic transformation; Shape memory (SM) effect

Indexed keywords

COLD ROLLING; COLD WORKING; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; THERMAL EXPANSION; THICKNESS MEASUREMENT;

CU-ZN-AL; LOW THERMAL EXPANSION (LTE); MARTENSITIC TRANSFORMATION; ROLLING DIRECTION (RD);

SHAPE MEMORY EFFECT;

EID: 7244236471     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0110-1     Document Type: Conference Paper

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