Wafer-applied underfill film laminating

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 317-325

  Zenner, Robert L D ^a   Carpenter, Barry S ^a   Chaudhuri, Arun ^b   Stepniak, Frank ^b   Post, Scott ^b   Johnson, Jerry ^b  

^a 3M COMPANY   (United States)

^b Delphi Delco Electronic Systems   (United States)

Author keywords

Film; Flip chip; Laminating; Pre applied; Reliability; Underfill

Indexed keywords

CHIP SCALE PACKAGES; FILMS; FLIP CHIP DEVICES; LAMINATING; PACKAGING MATERIALS; RELIABILITY; SOLDERING;

FILM LAMINATING PROCESS; FLIP CHIP; FLIP CHIP BONDING; LAMINATION PROCESS; PRE-APPLIED; UNDERFILL MATERIALS; UNDERFILLS; WAFER APPLIED UNDERFILL;

WAFER BONDING;

EID: 7244224563     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990405     Document Type: Conference Paper

References (8)

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8. S. Charles, M. Kropp, R. Kinney, S. Hackett, R. Zenner, F. B. Li, R. Mader, P. Hogerton, A. Chaudhuri, F. Stepniak, and M. Walsh, "PreApplied Underfill Adhesives for Flip Chip Attachment," IMAPS Proceedings, International Symposium on Microelectronics, Baltimore, MD, October, 2001, ISBN 0-930815-64-5, pp. 178-183.