Microstructure-based multiscale modeling of elevated temperature deformation in aluminum alloys

Acta Materialia

Volumn 58, Issue 3, 2010, Pages 1074-1086

  Krajewski, Paul E ^a   Hector Jr , Louis G ^a   Du, Ningning ^b   Bower, Allan F ^b  

^a GENERAL MOTORS CORPORATION   (United States)

^b Brown University   (United States)

Author keywords

Aluminum alloys; Creep; Grain boundaries; Micromechanical modeling; Superplasticity

Indexed keywords

AL ALLOYS; AL-MG ALLOY; COMPUTED FLOWS; DISLOCATION CREEP; ELEVATED TEMPERATURE; ELEVATED TEMPERATURE DEFORMATION; FINITE ELEMENT SIMULATIONS; FLOW DATA; GAS PRESSURE FORMING; GRAIN SIZE; MICRO-MECHANICAL MODELING; MICROSTRUCTURE-BASED MODEL; MULTI-SCALE MODELING; MULTISCALE MODELS; POLYCRYSTALLINE; SCALE MODELS; STRESS-INDUCED DIFFUSION; TENSILE MEASUREMENTS;

ALUMINUM; CERIUM ALLOYS; COMPOSITE MICROMECHANICS; CONSTITUTIVE MODELS; CREEP; FORMING; GRAIN BOUNDARIES; GRAIN BOUNDARY SLIDING; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; SIMULATORS; SUPERPLASTICITY;

ALUMINUM ALLOYS;

EID: 72149118491     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.10.023     Document Type: Article

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